Hot spot identification, inspection, and review
US9330987B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2014 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Sep 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for identifying, inspecting, and reviewing all hot spots on a specimen is disclosed by using at least one SORIL e-beam tool. A full die on a semiconductor wafer is scanned by using a first identification recipe to obtain a full die image of that die and then design layout data is aligned and compared with the full die image to identify hot spots on the full die. Threshold levels used to identify hot spots can be varied and depend on the background environments close thereto, materials of the specimens, defect types, and design layout data. A second recipe is used to selectively inspect locations of all hot spots to identify killers, and then killers can be reviewed with a third recipe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.