Integrated circuit package with voltage distributor

US9331046B2 · kind B2 · utility

Assignee

• Freeescale Semiconductor, Inc. · US

Inventors

• Chu-Chung Lee · Round Rock, US
• Kian Leong Chin · Kuala Lumpur, MY
• Kevin J. Hess · Austin, US
• James P. Johnston · Wharton, US
• Tu-Anh N. Tran · Austin, US
• Heng Keong Yip · Shah Alam, MY

Key dates

• Filing date: Jun 26, 2014
• Grant date: May 3, 2016
• Expiry date: Dec 14, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/19104
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit package includes a semiconductor die attached to a package support. The die has a plurality of peripheral bond pads along a periphery of the die and a first bond pad on an interior portion of the die wherein the first bond pad is a power supply bond pad. A conductive distributor is over the die and within a perimeter of the die and has a first opening. The plurality of bond pads are located between the perimeter of the die and a perimeter of the conductive distributor. The first bond pad is in the first opening. A first bond wire is connected between the first bond pad and the conductive distributor. A second bond wire is connected between a first peripheral bond pad of the plurality of peripheral bond pads and the conductive distributor.