Semiconductor device
US9331057B2 · kind B2 · utility
1Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2007 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Jan 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed. One embodiment provides a semiconductor chip. The semiconductor chip includes a first electrode of a capacitor. An insulating layer is arranged on top of the first electrode. A second electrode of the capacitor is applied over the insulating layer, wherein the second electrode is made of a conductive layer arranged over the semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.