Method for manufacturing liquid ejection head substrate
US9333749B2 · kind B2 · utility
3Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2012 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Jul 6, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a liquid ejection head substrate, including: (1) a step for etching a substrate, which has an energy generating element at a side of a first surface, from a side of a second surface, which is a surface on the opposite side from the first surface, thereby to form at a time at least a part of a liquid supply port and a recess along a cutting section of the substrate; (2) a step for irradiating a laser beam toward the side of first surface from the etched surface of the recess so as to form a reformed portion inside the substrate; and (3) a step for cutting the substrate at the reformed portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.