Residual material detection in backdrilled stubs
US9341670B2 · kind B2 · utility
6Cited by
5References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2014 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Dec 23, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T408/05
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A stub of a via formed in a printed circuit board is backdrilled to a predetermined depth. A capacitance probe is positioned within the via. Then the capacitance probe is used to obtain a test capacitance measurement. The test capacitance measurement is compared to a predetermined baseline capacitance measurement. Residual conductive plating material in the backdrilled stub causes the test capacitance measurement to exceed the predetermined baseline capacitance measurement. An indication is made that the predetermined baseline capacitance measurement has been exceeded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.