Portable electrostatic chuck carrier for thin substrates

US9343347B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Dieter Haas · Bruchköbel, DE
• Majeed A. Foad · Sunnyvale, US
• Ralf Hofmann · Heidenheim, DE

Key dates

• Filing date: Sep 5, 2013
• Grant date: May 17, 2016
• Expiry date: May 12, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6831
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments of a portable electrostatic chuck for use in a substrate process chamber to support an ultra-thin substrate when disposed thereon are provided herein. In some embodiments, a portable electrostatic chuck may include a carrier comprising a dielectric material; an electrically conductive layer disposed on a top surface of the carrier; a dielectric layer disposed over the electrically conductive layer, such that the electrically conductive layer is disposed between the carrier and the dielectric layer; and at least one conductor coupled to the electrically conductive layer, wherein the portable electrostatic chuck is configured to electrostatically retain the ultra-thin substrate to the portable electrostatic chuck, wherein the portable electrostatic chuck is further configured to be handled and moved by substrate processing equipment outside of the substrate process chamber, and wherein the portable electrostatic chuck is sized to support large ultra-thin substrates.