Thomas Rohleder
6Patents
3h-index
6Co-inventors
39Inventor score
Filing activity: Dec 20, 2012 → Sep 30, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9847258B2 | Plasma dicing with blade saw patterned underside mask | Electricity | 13 | Active |
| US8809166B2 | High die strength semiconductor wafer processing method and system | Performing Operations; Transporting | 8 | Active |
| US9601437B2 | Plasma etching and stealth dicing laser process | Electricity | 6 | Active |
| US8895363B2 | Die preparation for wafer-level chip scale package (WLCSP) | Electricity | 3 | Active |
| US9812361B2 | Combination grinding after laser (GAL) and laser on-off function to increase die strength | Electricity | 1 | Active |
| US9349645B2 | Apparatus, device and method for wafer dicing | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.