Contact arrangements for stackable microelectronic package structures with multiple ranks
US9349707B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Jan 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus relates generally to a microelectronic assembly. In this apparatus, a first substrate and a second substrate each have opposing surfaces. Contact arrangements are disposed on a surface of the first substrate, including: first contacts disposed as a ring to provide a first array of the contact arrangements on such surface; and second contacts disposed interior to the ring of the first contacts to provide a second array of the contact arrangements on the first surface. The first contacts and the second contacts are for interconnection with first microelectronic dies and second microelectronic dies. The second microelectronic dies are disposed below the first microelectronic dies in same a package as the first microelectronic dies. The first microelectronic dies and the second microelectronic dies include at least two ranks thereof for commonly sharing the first contacts and the second contacts among the first microelectronic dies and the second microelectronic dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.