Electronic component with sheet-like redistribution structure

US9349709B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Juergen Hoegerl · Regensburg, DE
• Georg Meyer-Berg · Birkenfeld, DE

Key dates

• Filing date: Dec 4, 2013
• Grant date: May 24, 2016
• Expiry date: Feb 16, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component comprising an electrically conductive chip carrier comprising an electrically insulating core structure at least partially covered with electrically conductive material, at least one electronic chip each having a first main surface attached to the chip carrier, and a sheet-like redistribution structure attached to a second main surface of the at least one electronic chip and configured for electrically connecting the second main surface of the at least one electronic chip with the chip carrier.