Submicron gap thermophotovoltaic structure and fabrication method
US9349891B2 · kind B2 · utility
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36Claims
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Key dates
| Filing date | Jan 20, 2014 |
| Grant date | May 24, 2016 |
| Priority date | — |
| Expiry date | Jan 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An MTPV thermophotovoltaic chip comprising a photovoltaic cell substrate, micron/sub-micron gap-spaced from a juxtaposed heat or infrared radiation-emitting substrate, with a radiation-transparent intermediate window substrate preferably compliantly adhered to the photovoltaic cell substrate and bounding the gap space therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.