Heating/cooling pedestal for semiconductor-processing apparatus
US9353441B2 · kind B2 · utility
449Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2012 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Aug 1, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A pedestal for supporting a substrate includes: a heating plate for heating the substrate; an upper cooling plate for cooling the substrate, installed on the heating plate and provided with an upper fluid path for passing a cooling fluid therethrough; and an lower cooling plate for cooling the substrate, installed under the heating plate and including a lower fluid path for passing a cooling fluid therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.