Integrated circuit package stacking system with redistribution and method of manufacture thereof
US9355962B2 · kind B2 · utility
10Cited by
26References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2009 |
| Grant date | May 31, 2016 |
| Priority date | — |
| Expiry date | Dec 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the support panel; fabricating a package substrate; coupling an integrated circuit die to the package substrate; mounting the base frame over the integrated circuit die and the package substrate; and removing the support panel from the base frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.