Patent · US Active

Electronic device and method for fabricating an electronic device

US9355984B2 · kind B2 · utility

1Cited by

0References

5Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Irmgard Escher-Poeppel · Regensburg, DE
Eduard Knauer · Deuerling, DE
Thomas Kunstmann · Hemau, DE
Peter Scherl · Regensburg, DE
Raimund Foerg · Straubing, DE

Key dates

Filing date	Jul 18, 2013
Grant date	May 31, 2016
Priority date	—
Expiry date	Oct 15, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An embodiment method for fabricating electronic devices having two components connected by a metal layer includes applying a metal layer to each component and connecting the metal layers such that a single metal layer is formed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.