Apparatuses and methods for controlling PH in electroplating baths
US9359688B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2012 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Feb 14, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/001
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are methods of electroplating a metal onto a substrate surface in an electroplating bath and adjusting the pH of the bath. The methods may include exposing the substrate surface, a counter-electrode, and an acid generating surface to the bath, biasing the substrate surface sufficiently negative relative to the counterelectrode such that metal ions from the bath are reduced and plated onto the substrate surface, and biasing the acid generating surface sufficiently positive relative to the counterelectrode such that free hydrogen ions are generated at the acid generating surface thereby decreasing the pH of the bath. Also disclosed are apparatuses for electroplating metal onto a substrate surface in an electroplating bath, and for adjusting the pH of the electroplating bath. The apparatuses may include an acid generating surface configured to generate free hydrogen ions in the bath upon supply of sufficient positive voltage bias relative to a counterelectrode electrical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.