Substrate processing method, substrate processing apparatus, and storage medium
US9362106B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jun 5, 2013 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jun 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02052
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer is held horizontally and rotated by a substrate holding mechanism. An aqueous alkaline solution is supplied to a wafer by a nozzle and caused to flow from a central portion to a peripheral edge portion of the wafer, thereby etching the wafer. An amount of oxygen, which is equal to or more than the amount of oxygen in atmospheric air involved in the aqueous alkaline solution flowing on the wafer, is previously dissolved in the aqueous alkaline solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.