Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages
US9362143B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2012 |
| Grant date | Jun 7, 2016 |
| Priority date | — |
| Expiry date | Jan 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for forming semiconductor device packages include applying a photoimageable dielectric adhesive material to a major surface of a semiconductor die and at least partially over conductive elements on the semiconductor die. The photoimageable dielectric adhesive material may be removed from over the conductive elements. The conductive elements are aligned with and bonded to bond pads of a substrate, and the semiconductor die and the substrate are adhered with the photoimageable dielectric adhesive material. A semiconductor device package includes at least one semiconductor die including conductive structures thereon, a substrate including bond pads thereon that are physically and electrically connected to the conductive structures, and a developed photoimageable dielectric adhesive material disposed between the semiconductor die and the substrate around and between adjacent conductive structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.