Method of electroplating uniform copper layers
US9365943B2 · kind B2 · utility
0Cited by
14References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2011 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Dec 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Electroplating methods provide substantially uniform deposits of copper on the edges and walls of through-holes of printed circuit boards. The electroplating methods provide copper deposits which have high throwing power.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.