High density memory card using folded flex
US9367712B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2007 |
| Grant date | Jun 14, 2016 |
| Priority date | — |
| Expiry date | Aug 1, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/0772
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A memory card comprising a flexible substrate (a “flex”) which is integrated in the memory card and folded in a prescribed manner subsequent to having various active and passive devices (e.g., controller and memory devices) surface mounted thereto. The active and passive devices are attached to a common side of the flex, and electrically connected to a conductive pattern disposed thereon. The conductive pattern itself electrically communicates with external signal contacts also formed on the flex. The use of folded flex technology in the memory card of the present invention allows the same to support four or more standard, pre-packaged memory devices, thus providing the memory card with substantially increased capacity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.