High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same
US9372214B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2012 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Nov 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P3/18
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
High frequency interconnect structures, electronic assemblies that utilize high frequency interconnect structures, and methods of operating the same. The high frequency interconnect structures include a plurality of dielectric waveguides and are configured to communicatively connect a plurality of transmitters with a plurality of receivers and to convey a plurality of signals therebetween. The plurality of signals may include a plurality of electromagnetic waves and may have a frequency of at least 200 GHz. The high frequency interconnect structures further may be configured to decrease a potential for crosstalk between a first signal that is conveyed by a first dielectric waveguide of the plurality of dielectric waveguides and a second signal that is conveyed by a second dielectric waveguide of the plurality of dielectric waveguides, such as through control of a passband of the first dielectric waveguide relative to the second dielectric waveguide and/or the use of a crosstalk mitigation structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.