Methods for stripping photoresist and/or cleaning metal regions
US9373497B2 · kind B2 · utility
3Cited by
161References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2013 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Feb 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67069
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods are provided for cleaning metal regions overlying semiconductor substrates. A method for removing material from a metal region comprises heating the metal region, forming a plasma from a gas comprising hydrogen and carbon dioxide, and exposing the metal region to the plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.