David Chen
8Patents
7h-index
20Co-inventors
59Inventor score
Filing activity: May 1, 2002 → Feb 5, 2013
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6867086B1 | Multi-step deposition and etch back gap fill process | Electricity | 387 | Expired |
| US8058181B1 | Method for post-etch cleans | Electricity | 33 | Active |
| US6693043B1 | Method for removing photoresist from low-k films in a downstream plasma system | Electricity | 26 | Expired |
| US6855225B1 | Single-tube interlaced inductively coupling plasma source | Electricity | 19 | Expired |
| US7390755B1 | Methods for post etch cleans | Electricity | 17 | Expired |
| US7569492B1 | Method for post-etch cleans | Electricity | 15 | Active |
| US8435895B2 | Methods for stripping photoresist and/or cleaning metal regions | Electricity | 9 | Active |
| US9373497B2 | Methods for stripping photoresist and/or cleaning metal regions | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.