Patent · US Active

Stacked microelectronic dice embedded in a microelectronic substrate

US9373588B2 · kind B2 · utility

0Cited by

2References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Reinhard Mahnkopf · Oberhaching, DE
Wolfgang Molzer · Ottobrunn, DE
Bernd Memmler · Riemerling, DE
Edmund Goetz · Dachau, DE
Hans-Joachim Barth · Munich, DE
Sven Albers · Regensburg, DE
Thorsten Meyer · Regensburg, DE

Key dates

Filing date	Sep 24, 2013
Grant date	Jun 21, 2016
Priority date	—
Expiry date	Sep 24, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.