Chip substrate having a lens insert
US9374890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2014 |
| Grant date | Jun 21, 2016 |
| Priority date | — |
| Expiry date | Nov 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A chip substrate includes: a conductive layer being stacked in one direction and constituting a chip substrate; an insulator being alternately stacked with the conductive layer and electrically separating the conductive layer; and a lens insert having: a depression reaching down to a predetermined depth from a specified area of an upper surface of the chip substrate overlapping with the insulator; and a predetermined number of sides on the upper surface wherein arcs are formed at regions where the sides are met with each other. Since the space for inserting a lens can be formed to have a shape comprising straight lines, and a lens to be inserted can also be manufactured in a shape comprising straight lines, therefore the manufacturing process for a lens to be inserted into the chip substrate can be further simplified.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.