Method for manufacturing a micromechanical system

US9376314B2 · kind B2 · utility

Assignee

• Infineon Technologies Dresden GmbH & Co. KG · DE

Inventors

• Thoralf Kautzsch · Dresden, DE
• Heiko Froehlich · Radebeul, DE
• Mirko Vogt · Dresden, DE
• Maik Stegemann · Freital, DE
• Boris Binder · Dresden, DE

Key dates

• Filing date: Jun 26, 2014
• Grant date: Jun 28, 2016
• Expiry date: Jun 26, 2034

Classification

• Technology area (CPC G): Physics
• CPC primary: G01D5/145
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A method for manufacturing a micromechanical system includes forming in a Front-End-of-Line (FEOL) process transistors in a transistor region; after the FEOL-process, forming a sacrificial layer; structuring the sacrificial layer to form a structured sacrificial layer; forming a functional layer at least partially covering the structured sacrificial layer; and removing the sacrificial layer to create a cavity.