Plasma processing device and operation method
US9376751B2 · kind B2 · utility
1Cited by
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12Claims
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Key dates
| Filing date | Feb 5, 2015 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | Feb 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An operation method of a plasma processing device, includes performing a plasma process on a workpiece by supplying first high frequency power of a predetermined output to an electrode and generating plasma; and performing a charge storage process before the plasma process when a time interval from an end of a previous operation of the plasma processing device exceeds a predetermined interval, the charge storage process including supplying, to the electrode, second high frequency power of a lower output than the predetermined output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.