Semiconductor wafers, and testing methods thereof
US9377501B2 · kind B2 · utility
0Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2014 |
| Grant date | Jun 28, 2016 |
| Priority date | — |
| Expiry date | May 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2209/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention provides a semiconductor wafer with a die area and a scribe area, and the semiconductor wafer includes a die and a testing circuit. The die is formed on the die region of the semiconductor wafer, and the die includes a main circuit. The testing circuit is disposed on the scribe area of the semiconductor wafer, and is electrically connected to the die for testing the main circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.