Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
US9383138B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Mar 30, 2007 |
| Grant date | Jul 5, 2016 |
| Priority date | — |
| Expiry date | Aug 31, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF27B17/0025
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Methods and heat treatment apparatus for heating a substrate and any layer carried on the substrate during a bake process. A heat exchange gap between the substrate and a heated support is at least partially filled by a gas having a high thermal conductivity. The high thermal conductivity gas is introduced into the heat exchange gap by displacing a lower thermal conductivity originally present in the heat exchange gap when the substrate is loaded. Heat transfer across the heat exchange gap is mediated by the high thermal conductivity gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.