Suppression of parasitic deposition in a substrate processing system by suppressing precursor flow and plasma outside of substrate region
US9388494B2 · kind B2 · utility
15Cited by
12References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2012 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Oct 30, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3244
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A substrate processing system includes a showerhead that comprises a base portion and a stem portion and that delivers precursor gas to a chamber. A collar connects the showerhead to an upper surface of the chamber. The collar includes a plurality of slots, is arranged around the stem portion of the showerhead, and directs purge gas through the plurality of slots into a region between the base portion of the showerhead and the upper surface of the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.