Method and apparatus for wafer backgrinding and edge trimming on one machine
US9390903B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2013 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | May 30, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02021
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A workpiece processing apparatus is provided. The apparatus includes a rotary turntable having one or more spindles thereon, the turntable being configured to rotate about a turntable axis. Each of the spindles is configured to receive and secure thereon a workpiece to be processed by the apparatus. Each of the spindles can rotate about their own independent axes. The apparatus includes one or more grind spindles that overlay the turntable and are configured to communicate with the workpieces. The apparatus processes the workpieces by transitioning between first and second operational states. The first operational state centers the spindles and the workpieces thereon under the grind spindle to condition an entire top surface of the workpieces. The second operational state offsets the spindles from the center of the grind spindle to condition a perimeter edge of the workpieces. A controller can govern the transition between first and second operational states.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.