Substrate processing apparatus
US9390943B2 · kind B2 · utility
2Cited by
37References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2013 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Feb 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/32136
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus generates an electric field in a processing space between a lower electrode to which a high frequency power is supplied and an upper electrode facing the lower electrode and performs plasma processing on a substrate mounted on the lower electrode by using a plasma generated by the electric field. Distribution of a plasma density in the processing space is controlled by a magnetic field generated by controlling a plurality of electromagnets provided at a top surface of the upper electrode which is provided to be opposite to the processing space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.