Method for soldering a cap to a support layer
US9390988B2 · kind B2 · utility
0Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2012 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Jan 9, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/13
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.