Image sensor pickup region layout
US9391101B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jan 16, 2014 |
| Grant date | Jul 12, 2016 |
| Priority date | — |
| Expiry date | Jan 25, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/8027
Abstract
Embodiments of the present disclosure include an image sensor device and methods of forming the same. An embodiment is an image sensor device including a first plurality of pickup regions in a photosensor array area of a substrate, each of first plurality of pickup regions having a first width and a first length, a second plurality of pickup regions in a periphery area of the substrate, the periphery area along at least one side of the photosensor array area, each of second plurality of pickup regions having a second width and a second length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.