LED lamp with LED assembly on a heat sink tower
US9395074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2013 |
| Grant date | Jul 19, 2016 |
| Priority date | — |
| Expiry date | May 7, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B20/30
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.