Apparatus and method for optical calibration of wafer placement by a robot
US9405287B1 · kind B1 · utility
4Cited by
11References
20Claims
0Family size
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Key dates
| Filing date | Jul 22, 2015 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Jul 22, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/40572
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
An optical calibration method and apparatus for calibration of wafer positioning within a reactor chamber under process conditions employs an array of cameras in a lid of the chamber using images of the wafer edge to locate the wafer relative to the reference feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.