Through printed circuit board (PCB) vias
US9408304B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2014 |
| Grant date | Aug 2, 2016 |
| Priority date | — |
| Expiry date | Aug 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A broadband through printed circuit board (PCB) for millimeter wave application and methods of manufacture are disclosed. The structure includes a multiple layered body and an opening in the multiple layered body. The structure further includes at least one signal via extending through the opening. The structure further includes ground vias extending through the opening and on opposing sides of the at least one signal via. The structure further includes a ground plate above and below the opening and electrically connected to the ground vias at respective ends. The structure further includes a microstrip signal via above and below the opening and electrically connected to the at least one signal via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.