Temperature measuring method and plasma processing system
US9412565B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 30, 2015 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Jan 30, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/80
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature measuring method for measuring a temperature of a member corresponding to a measuring object arranged within a chamber of a plasma processing apparatus is provided. The temperature measuring method involves obtaining a function (f) for correcting a correction target temperature (Tmeas) according to a measurement window temperature (Tw), the function (f) being computed based on the correction target temperature (Tmeas) corresponding to a temperature of the measuring object measured via a measurement window arranged at the chamber, a reference temperature (Tobj) corresponding to a temperature of the measuring object measured without using the measurement window, and the measurement window temperature (Tw) corresponding to a temperature of the measurement window. The temperature measuring method further involves measuring the correction target temperature (Tmeas), measuring the measurement window temperature (Tw), and correcting the correction target temperature (Tmeas) according to the measurement window temperature (Tw) based on the obtained function (f).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.