Thermal spreading for an externally pluggable electronic module
US9414527B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2014 |
| Grant date | Aug 9, 2016 |
| Priority date | — |
| Expiry date | Dec 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling apparatus for dissipating heat from an electronic module is disclosed. The cooling apparatus may include a thermally conductive shell having a surface in contact with, and configured to conduct heat away from, the module. The apparatus may also include an electrically insulative layer positioned between, and configured to conduct heat from, the module to the shell. The apparatus may also include an electrical cord, attached to the module that contains a thermally conductive layer in thermally conductive contact with the shell that is configured to conduct heat away from the shell. The apparatus may also include an electrically insulative layer between the thermally conductive layer and an electrical conductor within the electrical cord. The apparatus may also include an electrically insulative layer, positioned between the thermally conductive layer and an electrical cord outer surface, configured to convectively dissipate heat from the thermally conductive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.