Integrated fan-out package-on-package testing
US9417285B2 · kind B2 · utility
4Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2013 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Apr 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15192
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device for testing a bottom package of an integrated fan-out (InFO) Package-on-Package (PoP) comprises a bottom fixture having a space to accommodate the bottom package during testing and a detachable top cover, configured for conducting at least one test of the bottom package, wherein one or both of the bottom fixture and the top cover have a plurality of probing contacts for testing of the bottom package and wherein the device can be opened for placement of the bottom package under testing, and the cover is attachable to the bottom fixture for conducting the testing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.