Device and method for aligning substrates
US9418882B2 · kind B2 · utility
6Cited by
2References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 17, 2013 |
| Grant date | Aug 16, 2016 |
| Priority date | — |
| Expiry date | Jun 17, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/26
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for alignment and contact-making of a first substrate with a second substrate using several detection units as well as a corresponding device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.