Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device
US9431314B2 · kind B2 · utility
2Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2011 |
| Grant date | Aug 30, 2016 |
| Priority date | — |
| Expiry date | Jun 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting resin composition for an underfilling of a semiconductor comprising, as essential components, a thermosetting resin, a curing agent, a flux agent and two or more inorganic fillers with different mean particle sizes, wherein the inorganic fillers include an inorganic filler with a mean particle size of no greater than 100 nm and an inorganic filler with a mean particle size of greater than 100 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.