Aluminum clad copper structure of an electronic component package and a method of making an electronic component package with an aluminum clad copper structure
US9437459B2 · kind B2 · utility
42Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 2014 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | May 19, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic component package that includes a package substrate having an aluminum bond pad formed from an aluminum clad copper structure. The aluminum clad copper structure is attached to a dielectric layer. An electronic component is attached to the substrate and includes a conductive structure electrically coupled to the aluminum bond pad. The aluminum bond pad, the electronic component, and at least a portion of the substrate are encapsulated with an encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.