Patent · US Active

Chip-embedded packages with backside die connection

US9437516B2 · kind B2 · utility

1Cited by

6References

20Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Ralf Otremba · Kaufbeuren, DE
Josef Höglauer · Heimstetten, DE
Manfred Schindler · Borgo San Lazzaro, DE
Johannes Lodermeyer · Kinding, DE
Thorsten Scharf · Regensburg, DE

Key dates

Filing date	Jan 7, 2014
Grant date	Sep 6, 2016
Priority date	—
Expiry date	May 1, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1815
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a semiconductor die and a metal clip. In one embodiment, the semiconductor die is embedded in an insulating material and has a first surface facing in a first direction, a second surface facing in a second direction opposite the first direction and an edge extending between the first and second surfaces. The metal clip is embedded in the insulating material above the die and bonded to the second surface of the die. Part of the metal clip extends laterally beyond the edge of the die and vertically in the first direction to provide galvanic redistribution at the second surface of the die. Other embodiments of semiconductor packages are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.