Air trench in packages incorporating hybrid bonding
US9443796B2 · kind B2 · utility
198Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 2013 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Dec 14, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package component includes a surface dielectric layer including a planar top surface, a metal pad in the surface dielectric layer and including a second planar top surface level with the planar top surface, and an air trench on a side of the metal pad. The sidewall of the metal pad is exposed to the air trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.