Method for forming air gap structure using carbon-containing spacer
US9443956B2 · kind B2 · utility
11Cited by
16References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2015 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Apr 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/017
Abstract
A method includes forming a line feature above a substrate. Carbon-containing spacers are formed on sidewalls of the line feature. A first dielectric layer is formed above the carbon spacers and the line feature. The first dielectric layer is planarized to expose upper ends of the carbon-containing spacers. An ashing process is performed to remove the carbon-containing spacers and define air gaps adjacent the line feature. A cap layer is formed to seal the upper ends of the air gaps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.