Semiconductor strips with undercuts and methods for forming the same
US9443961B2 · kind B2 · utility
1Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2013 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Oct 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D30/6735
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit device includes a semiconductor substrate, and a semiconductor strip extending into the semiconductor substrate. A first and a second dielectric region are on opposite sides of, and in contact with, the semiconductor strip. Each of the first dielectric region and the second dielectric region includes a first portion level with the semiconductor strip, and a second portion lower than the semiconductor strip. The second portion further includes a portion overlapped by the semiconductor strip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.