Patent · US Active

Galvanic process for filling through-holes with metals, in particular of printed circuit boards with copper

US9445510B2 · kind B2 · utility

1Cited by

14References

22Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Bert Reents · Berlin, DE
Thomas Pliet · Berlin, DE
Bernd Roelfs · Berlin, DE
Toshiya Fujiwara · Tokyo, JP
Rene Wenzel · Berlin, DE
Markus Youkhanis · Berlin, DE
Soungsoo Kim · Berlin, DE

Key dates

Filing date	Aug 30, 2005
Grant date	Sep 13, 2016
Priority date	—
Expiry date	Aug 18, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1492
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The present invention relates to a galvanic process for filling through-holes with metals. The process is particularly suitable for filling through-holes of printed circuit boards with copper. The process comprises the following steps: (i) formation of a narrow part in the center of a through-hole by electroplating; and (ii) filling the through-hole obtained in step (i) with metal by electroplating.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.