Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method
US9449896B2 · kind B2 · utility
2Cited by
1References
28Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jan 6, 2015 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Jan 6, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device includes a support, a three-dimensional integrated structure above the support, and a lateral encapsulation region arranged around the structure. The lateral encapsulation region includes first channels configured to make it possible to circulate a cooling fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.