Olga Kokshagina
7Patents
1h-index
12Co-inventors
37Inventor score
Filing activity: Aug 18, 2014 → Nov 17, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9449896B2 | Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method | Electricity | 2 | Active |
| US9953895B2 | Heat pipe and method of manufacturing the same | Electricity | 1 | Active |
| US9418954B2 | Integrated circuit chip assembled on an interposer | Electricity | 1 | Active |
| US10186474B2 | Heat pipe and method of manufacturing the same | Electricity | 0 | Active |
| US10298151B2 | Device for converting thermal energy into electrical energy | Performing Operations; Transporting | 0 | Active |
| US9615443B2 | Integrated circuit chip cooling device | Electricity | 0 | Active |
| US9780015B2 | Integrated circuit chip assembled on an interposer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.