Yann Beilliard
3Patents
1h-index
6Co-inventors
27Inventor score
Filing activity: May 27, 2014 → Jan 6, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9449896B2 | Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method | Electricity | 2 | Active |
| US11305372B2 | Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials | Electricity | 0 | Active |
| US9165861B2 | Process for producing at least one through-silicon via with improved heat dissipation, and corresponding three-dimensional integrated structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.