Electrically conductive adhesive (ECA) for multilayer device interconnects

US9451693B2 · kind B2 · utility

Assignee

• i3 Electronics, Inc.

Inventors

• Rabindra N. Das · Lexington, US
• Voya R. Markovich · Endwell, US
• John M. Lauffer · Waverly, US
• Roy H. Magnuson · Endicott, US
• Konstantinos I. Papathomas · Endicott, US
• Benson Chan · Vestal, US

Key dates

• Filing date: Aug 5, 2011
• Grant date: Sep 20, 2016
• Expiry date: Aug 5, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49165
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A multilayer capable electrically conductive adhesive (ECA) mixture for connecting multilevel Z-axis interconnects and a method of forming the ECA for connecting multilevel Z-axis interconnects. The multilayer capable ECA contains a mixture of constituent components that allow the paste to be adapted to specific requirements wherein the method of making a circuitized substrate assembly in which two or more subassemblies having potentially disparate coefficients of thermal expansion (CTE) are aligned and Z-axis interconnection are created during bonding. The metallurgies of the conductors, and those of a multilayer capable conductive paste, are effectively mixed and the flowable interim dielectric used between the mating subassemblies flows to engage and surround the conductor coupling.